Amazon Haul, With Prices Under $20, Launches to Grab Budget Shoppers

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• 8849 TANK Pad: rugged tablet with 10.95-inch FHD, 120Hz display
• Equipped with 21000mAh battery, 66W charging, dual-SIM 5G support
• Features laser projector, waterproof speakers, durable build for outdoors

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Earlier in 2024, I wrote about the 8849 TANK3 PRO, a rugged smartphone with a massive battery, DLP projector, 200-megapixel camera, and camping light. Now, 8849 by Unihertz is expanding its rugged device lineup with a tablet version, the 8849 TANK Pad.

The TANK Pad boasts a 10.95-inch IPS display with FHD resolution and a 120Hz refresh rate. The rugged tablet has IP68 and IP69K ratings, as well as MIL-STD-810H certification, enabling it to withstand drops, extreme temperatures, dirt, dust, and water.

Like the TANK3 PRO, the tablet’s rear shell includes a large camping light, ideal for outdoor use, and a pair of waterproof speakers rated at 105 dB, providing decent sound output in challenging environments. The camera system features a 50MP Sony IMX766 sensor on the rear, with a 32MP Sony IMX616 sensor on the front.

Large 21000mAh battery

The massive 23800mAh battery was arguably the main feature of the TANK3 PRO, and while the TANK Pad can’t match that, it does come with a large 21000mAh battery that supports 66W fast charging, offering extended use on a single charge.

The tablet runs Android 14 and is powered by a MediaTek Dimensity 8200 chipset. It comes with 16GB of LPDDR5 RAM, with the option for an additional 16GB in virtual memory, and 512GB of UFS 3.1 storage, expandable up to 2TB via microSD.

Connectivity includes dual-SIM 5G support, NFC, Bluetooth 5.3, and Wi-Fi 5. Additional features include a side-mounted fingerprint sensor, a USB Type-C port with OTG, an IR blaster, and a classic headphone jack.

As with the TANK3 PRO smartphone, the TANK Pad features a built-in DLP laser projector with an 854 x 480-pixel resolution, 100 lumens of brightness at the center, and 94% brightness uniformity. Its manual focus can be adjusted via a physical dial, with a range of 0.5 to 3 meters. For cooling, the device incorporates two waterproof outlets to vent hot air when the projector is in use.

With its waterproof speakers, powerful projector, and rugged durability, the TANK Pad, which retails for $799, has the potential to serve as a portable entertainment hub. We’ll be testing a review sample soon to find out if this device truly lets you create your very own mini outdoor cinema - even in the pool.

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Best Cloud Storage Software Options

With hacking and data theft becoming common, it's important to keep all your most precious documents, photos and videos safe in one of the best cloud storage services available.

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• High-performance mini PC with AMD Ryzen 9 and RTX graphics
• Supports up to 64TB storage with lightning-fast 10,000 MB/s speeds
• Features triple monitor support, Wi-Fi 7, and dual 10Gb Ethernet

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The Falco Prime A2 is a high-performance, budget-friendly mini PC currently seeking funding on Kickstarter.

Designed for content creators, media enthusiasts and gamers, this compact powerhouse is equipped with an AMD Ryzen 9 7940HX processor, optional NVIDIA GeForce RTX 4060 or 4070 mobile graphics, up to 64GB DDR5 RAM, and dual NVMe SSDs for the operating system.

The main selling point of the Falco Prime A2 is the 8x M.2 SSD bay that supports up to 64TB storage with read speeds up to 10,000 MB/s, allowing users to handle massive media libraries and high-speed data access. It also supports up to three monitors for a customizable multi-screen setup suited for different tasks, and network support comes in the form of Wi-Fi 7 and dual 10Gb Ethernet.

RAID

The mini PC offers two USB 3.2 Gen 2 Type-A ports (one front, one back), two USB 3.2 Gen 2 Type-C ports (one front, one back), and four USB 4 ports in the back for high-speed data transfer, along with a 3.5mm combo audio jack, and SD card and microSD slots for additional storage flexibility.

Users can configure RAID setups and choose between performance-boosting or redundancy options for the dual OS drives. The DDR5 RAM enhances data transfer rates and power efficiency, while a convection cooling system keeps the system running quietly and efficiently.

Early supporters on Kickstarter can secure the Super Early Bird price of $799 (a $500 discount from the $1,299 retail price), which includes the Ryzen 9 processor, RTX 4060M graphics, 32GB DDR5 RAM, and a 1TB SSD with the 8-slot SSD bay. Additional SSDs can be added to expand storage capacity further.

At the time of writing, the project has received $133,928 in pledges from 125 backers, well over the $5,000 goal, with 19 days to go. As with any crowdfunding project, backers should be aware that delays or changes to the final product can occur, and there's always a risk that the project may face challenges in production or fulfillment, so be warned.

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• CERN uses over one exabyte of storage for research
• The research laboratory relies on PROMISE and Toshiba for its needs
• Toshiba will be supplying CERN with 20TB hard drives

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As you might expect, the world’s largest particle physics laboratory requires some pretty extensive data storage systems to support its research into fundamental questions about the universe.

With particle collision detectors at the Large Hadron Collider (LHC) generating approximately 1TB of data per minute, CERN’s storage infrastructure rather obviously needs to be both high-capacity and highly reliable.

Since 2008, CERN has relied on PROMISE Technology’s VTrak J5800 24-bay JBOD enclosures and Toshiba’s Enterprise Capacity HDDs for its storage needs. The storage systems have inevitably evolved over time, beginning with 4TB hard drives and currently featuring Toshiba’s 18TB MG09 Series HDDs.

Supporting CERN’s future storage needs

Together, these systems provide CERN’s central data center with over one exabyte of storage, distributed across more than 120,000 hard drives housed in over 4,000 enclosures. This setup allows data from CERN to be shared with more than 170 research institutes around the world for analysis.

To meet increasing storage requirements, PROMISE Technology recently introduced the 60-bay VTrak J5960 JBOD enclosure, featuring ‘Greenboost’ technology to reduce power consumption by up to 30%. These will be used with Toshiba’s 20TB MG10 Series HDDs, and potentially its 28TB drives in the future.

“In our quest to unravel the mysteries of the universe, we need partners who understand the importance of data storage, reliability, and efficiency with solutions tailored to our unique needs," said Eric Bonfillou, Deputy Group Leader of CERN’s IT Fabric group.

“We continue to develop higher capacities, up to 30TB and beyond, as HDDs are and will remain essential for storing the exabytes of data that CERN and the entire world produce in a cost-effective and energy-efficient manner," added Rainer W. Kaese, Senior Manager Business Development, Storage Products Division at Toshiba.

Toshiba has released a new video showcasing its partnership with PROMISE Technology to enhance data storage solutions for CERN. You can watch this below.

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Best Solar Panel Installation Companies in Puerto Rico

Electricity costs are significantly higher for residents in Puerto Rico due to its isolation from the U.S. mainland. Solar panels present a clean energy alternative, offering a way to reduce the island’s steep utility bills.

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• Fujitsu and AMD partner to develop energy-efficient HPC/AI platforms
• Partnership aims to broaden access to AI, support open-source
• Monaka chip features 288 cores, 2nm process, Armv9-A architecture

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Fujitsu and AMD have announced a new strategic partnership focused on developing HPC and AI platforms.

This collaboration will combine Fujitsu’s ARM-based processor technology with AMD’s GPU expertise, aiming to build energy-efficient and open-source solutions addressing the growing demand for diverse, cost-effective computing architectures.

The partnership, formalized in a memorandum of understanding, covers joint efforts in technology development, commercialization, and ecosystem expansion, with a goal of creating powerful computing platforms by 2027.

Instinct accelerators

Central to this partnership is Fujitsu’s next-generation Arm-based processor, the Monaka chip, set for release in 2027.

As we first reported in July 2024, Monaka will feature Armv9-A architecture, a 2nm process for high performance and power efficiency, and a 288-core structure (144 cores per socket). Notably, Monaka moves away from high-bandwidth memory in favor of PCIe 6.0 (CXL3.0), enhancing scalability and connectivity. This processor is expected to build upon Fujitsu’s work with the A64FX chip, used in the Fugaku supercomputer, and could support the upcoming FugakuNEXT project planned for 2030.

AMD will support Monaka with its Instinct accelerators, providing customers with flexible options for handling massive AI workloads while optimizing data center costs. The collaboration will also make use of AMD’s ROCm software stack and Fujitsu’s proprietary software, developing an open source ecosystem to accelerate the development of AI and HPC applications.

This joint venture will also involve global marketing efforts and customer engagement, as well as a shared customer center to support the development and implementation of AI technologies.

“By combining AMD’s innovative GPU technology with Fujitsu’s low-power/high-performance processor Fujitsu-Monaka, we seek to create an environment in which more companies will be able to utilize AI while reducing the power consumed by data centers," noted Vivek Mahajan, CTO of Fujitsu.

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Best Solar Panel Installation Companies in Alaska

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• Samsung to release 400-layer NAND chip for AI data centers
• New BV NAND tech boosts density and minimizes heat buildup
• Plans for 1,000-layer NAND by 2030 to expand capacity

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Samsung is working to launch a record-breaking 400-layer vertical NAND flash chip by 2026, reports have claimed.

A report by the Korea Economic Daily says Samsung’s Device Solutions (DS) division aims to advance the NAND flash market with its cutting-edge V10 NAND, designed to meet surging demand in AI data centers.

The company’s memory roadmap, as outlined in the report, shows plans for an advanced 10th-generation NAND that will utilize bonding technology to separately build memory cells and the peripheral circuitry on different wafers, later fusing them into a single chip. Known as bonding vertical NANDFlash (BV NAND), this new approach minimizes heat buildup and maximizes both capacity and performance, creating what Samsung has described as a “dream NAND for AI.”

1,000 layers by 2030

The BV NAND design, boasting a 1.6x increase in bit density per unit area, supports ultra-high-capacity solid-state drives (SSDs) ideal for AI applications.

Samsung’s current 286-layer V9 NAND chips marked a significant milestone, but the 400-layer V10 is expected to redefine capacity limits, potentially breaking the 200TB storage threshold for ultra-large AI hyperscaler SSDs, while improving energy efficiency.

For future releases, world’s largest memory chipmaker plans to introduce 11th-generation V11 NAND in 2027 with a 50% faster data transfer speed, further optimizing performance for high-demand data storage needs.

Samsung’s ambitious NAND roadmap extends even further, with plans for chips exceeding 1,000 layers by 2030, KED reports. This advancement aims to keep Samsung at the forefront of the high-capacity NAND market, where demand is spurred by AI applications that require expansive storage solutions to process vast volumes of data.

In the DRAM sector, Samsung aims to release sixth-generation 1c DRAM and seventh-generation 1d DRAM by the end of 2024, targeting use in high-performance AI chips. According to the Korea Economic Daily report, the company also has plans for sub-10 nm 0a DRAM by 2027, using a vertical channel transistor structure for greater stability and efficiency.

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GOP, Cruz Tell FCC 'Pencils Down' After Trump Win

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• Trillium offers 4x training boost, 3x inference improvement over TPU v5e
• Enhanced HBM and ICI bandwidth for LLM support
• Scales up to 256 chips per pod, ideal for extensive AI tasks

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Google Cloud has unleashed its latest TPU, Trillium, the sixth-generation model in its custom AI chip lineup, designed to power advanced AI workloads.

First announced back in May 2024, Trillium is engineered to handle large-scale training, tuning, and inferencing with improved performance and cost efficiency.

The release forms part of Google Cloud’s AI Hypercomputer infrastructure, which integrates TPUs, GPUs, and CPUs alongside open software to meet the increasing demands of generative AI.

A3 Ultra VMs arriving soon

Trillium promises significant improvements over its predecessor, TPU v5e, with over a 4x boost in training performance and up to a 3x increase in inference throughput. Trillium delivers twice the HBM capacity and doubled Interchip Interconnect (ICI) bandwidth, making it particularly suited to large language models like Gemma 2 and Llama, as well as compute-heavy inference applications, including diffusion models such as Stable Diffusion XL.

Google is keen to stress Trillium’s focus on energy efficiency as well, with a claimed 67% increase compared to previous generations.

Google says its new TPU has demonstrated substantially improved performance in benchmark testing, delivering a 4x increase in training speeds for models such as Gemma 2-27b and Llama2-70B. For inference tasks, Trillium achieved 3x greater throughput than TPU v5e, particularly excelling in models that demand extensive computational resources.

Scaling is another strength of Trillium, according to Google. The TPU can link up to 256 chips in a single, high-bandwidth pod, expandable to thousands of chips within Google’s Jupiter data center network, providing near-linear scaling for extensive AI training tasks. With Multislice software, Trillium maintains consistent performance across hundreds of pods.

Tied in with the arrival of Trillium, Google also announced the A3 Ultra VMs featuring Nvidia H200 Tensor Core GPUs. Scheduled for preview this month they will offer Google Cloud customers a high-performance GPU option within the tech giant’s AI infrastructure.

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