Techno

Saturday, December 21, 2024

Latest Tech News

TeamGroup claims CAMM2 memory promises high-speed DDR5 performance
Revolutionary design offers dual-channel operation in a single module
Limited motherboard compatibility poses challenges for CAMM2 adoption

TeamGroup has introduced its Compression Attached Memory Module 2 (CAMM2), promising high-speed DDR5 performance with its new T-Create lineup.

The company says CAMM2 features a revolutionary design that offers significant advantages over traditional memory types like SO-DIMM, U-DIMM, and R-DIMM. It supports dual-channel operation with just one module, streamlining system architecture and lowering power consumption.

The built-in Client Clock Driver (CKD) boosts signal integrity, making CAMM2 well-suited for slim notebooks while its optimized thermal design enhances heat dissipation, allowing higher performance despite the smaller form factor.

CAMM2-compatible motherboards are very scarce

The T-Create CAMM2 modules are designed with DDR5-7200 specifications and a CAS latency of CL34-42-42-84, delivering remarkable read, write, and copy speeds of up to 117GB/s, 108GB/s, and 106GB/s, respectively.

This performance is achieved through manual overclocking, which has driven latency down to 55ns, a significant reduction compared to typical DDR5 JEDEC specifications. TeamGroup is now focused on pushing boundaries and the company says it is working to achieve even faster speeds, aiming to reach DDR5-8000 and even DDR5-9000 in future iterations.

One major setback for TeamGroup lies in the availability of CAMM2-compatible motherboards, which are currently limited. The T-Create CAMM2 memory was tested on MSI’s Z790 Project Zero, one of the few boards currently compatible with this new form factor.

Other brands, such as Gigabyte, hint at possible CAMM2-enabled designs, like an upcoming TACHYON board. However, the CAMM2 ecosystem is still emerging, and widespread adoption may depend on the release of more compatible boards and competitive pricing.

Nevertheless, TeamGroup expects to launch the first-generation T-Create CAMM2 modules by Q1 2025, with broader motherboard support potentially arriving as manufacturers introduce new CPU platforms. With AMD and Intel rumoured to announce budget-friendly CPUs at CES 2025, the rollout of mid-range boards compatible with CAMM2 could align with TeamGroup’s release plans, potentially helping CAMM2 secure a foothold in the market.

CAMM2 offers a couple of advantages over the widely used SO-DIMM, UDIMM, and RDIMM standards. Notably, CAMM2 modules operate in dual-channel mode while only occupying a single physical slot. Furthermore, they incorporate a Client Clock Driver (CKD), similar to CUDIMM memory, which bolsters signal integrity at high speeds, allowing for more reliable and faster memory performance.

These features make CAMM2 particularly appealing for laptops, which often face limitations with current SO-DIMM speeds or non-upgradeable LPDDR5/5X options.

Via Tom's Hardware

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Latest Tech News

We might not see the OnePlus Open 2 until later in 2025
Previous leaks predicted a Q1 2025 launch
Major upgrades have been rumored for the foldable

A quick browse through our OnePlus Open review will tell you why we're very much looking forward to the foldable phone's successor – though if a new leak is to be believed, the wait for the OnePlus Open 2 might be longer than originally thought.

According to tipster Sanju Choudhary (via GSMArena), the handset is going to break cover during the second half of next year – anytime from July onwards. That contradicts an earlier rumor that it would be unveiled in the first three months of 2025.

There's no indication whether or not OnePlus has changed its plans, or if the launch date was originally set for the first quarter of next year and has since been pushed back (engineering foldable phones is a tricky challenge, after all).

It's also fair to say that none of these rumors can be confirmed until OnePlus actually makes its announcement. The original OnePlus Open was launched in October 2023, which doesn't really tell us much about a schedule for its successor.

Upgrades on the way

The OnePlus OPEN 2 is 🔥 ....H2 2025..December 20, 2024

Whenever the next OnePlus folding phone shows up, it sounds like it's going to be worth the wait – which has lasted 14 months and counting. Rumors have pointed to major upgrades in terms of the rear camera and the internal components.

We've also heard that the OnePlus Open 2 will have the biggest battery ever seen in a foldable, as well as being thinner and more waterproof than the handset it's replacing. That's a significant number of improvements to look forward to.

In our OnePlus Open review, we described the phone as "the only foldable phone that doesn't compromise", and there was particular praise for the design and the camera setup – so the upcoming upgrade has a lot to live up to.

Before we see another foldable from OnePlus, we'll see the OnePlus 13 and the OnePlus 13R made available worldwide: OnePlus has confirmed this is happening on January 7, so we could also get a teaser for the OnePlus Open 2 at the same time.

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Friday, December 20, 2024

Latest Tech News

15% of Steam users' playtime dedicated to 2024 games
47% of playtime on games up to eight years old
Many reasons for this, including more older games to play

Steam’s end-of-the-year review has always revealed some fascinating PC gaming trends and this year’s is no exception. According to 2024’s stats, only 15% of Steam users spent their total playing time on games that launched in 2024.

Looking further at the data that PC Gamer reports on, 47% of the total playing time on Steam was spent on games released in the last seven years, while 37% of that time was spent on games that launched eight years or more ago. Now the question is, why and what does this mean?

One possible explanation is that gamers could be focusing more on their backlogs rather than new releases. We do know that playtime for current releases is higher this year than in 2023, as there was an increase from 9% to 15%, which means players are buying new titles at least. There are other possibilities for this trend as well.

Other possibilities for this statistic

One reason could be that older games are easier to access due to their cheaper prices, especially due to the many Steam sales. There’s also the influence of the Steam Deck and what’s considered ‘Steam Deck playable,’ since many recent AAA games may be too demanding for a portable PC.

There’s also the fact that older live service games like Counter-Strike, Dota 2, and PUBG have made up Steam's Most Played charts, while newer titles have an incredibly difficult time breaking through and building a player base.

Another reason is that Steam has over 200,000 titles released over the course of decades, compared to the relatively paltry 18,000 games released in 2024 according to SteamDB. So naturally, more users will spend more time playing older games versus recent ones.

Regardless, 15% of playtime dedicated to new games is rather impressive, compared to 2022’s 17% stat. It means that the numbers are recovering after the massive dip in 2023. Hopefully next year we’ll see another increase, as gamers delve into more new titles.

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Latest Tech News

OpenAI announced upcoming o3 and o3-mini AI models.
The new models are enhanced "reasoning" AI models that build on the o1 and o1-mini models released this year.
Both models handily outperform existing AI models and will roll out in the next few months.

The final day of the 12 Days of OpenAI, brought back OpenAI CEO Sam Altman to show off a brand new set of AI models coming in the new year. The o3 and o3-mini models are enhanced versions of the relatively new o1 and o1-mini models. They're designed to think before they speak, reasoning out their answers. The mini version is smaller and aimed more at carrying out a limited set of specific tasks but with the same approach.

OpenAI is calling it a big step toward artificial general intelligence (AGI), which is a pretty bold claim for what is, in some ways, a mild improvement to an already powerful model. You might have noticed there's a number missing between the current o1 and the upcoming o3 model. According to Altman, that's because OpenAI wants to avoid any confusion with British telecom company O2.

So, what makes o3 special? Unlike regular AI models that spit out answers quickly, o3 takes a beat to reason things out. This “private chain of thought” lets the model fact-check itself before responding, which helps it avoid some of the classic AI pitfalls, like confidently spewing out wrong answers. This extra thinking time can make o3 slower, even if only a little bit, but the payoff is better accuracy, especially in areas like math, science, and coding.

One great aspect of the new models is that you can adjust that extra thinking time manually. If you’re in a hurry, you can set it to “low compute” for quick responses. But if you want top-notch reasoning, crank it up to “high compute” and give it a little more time to mull things over. In tests, o3 has easily outstripped its predecessor.

This is not quite AGI; o3 can't take over for humans in every way. It also does not reach OpenAI's definition of AGI, which describes models that outperform humans in the most economically valuable projects. Still, should OpenAI reach that goal, things get interesting for its partnership with Microsoft since that would end OpenAI's obligation to give Microsoft exclusive access to the most advanced AI models.

New year, new models

Right now, o3 and its mini counterpart aren’t available to everyone. OpenAI is giving safety researchers a sneak peek via Copilot Labs, and the rest of us can expect the o3-mini model to drop in late January, with the full o3 following soon after. It’s a careful, measured rollout, which makes sense given the kind of power and complexity we’re talking about here.

Still, o3 gives us a glimpse of where things are headed: AI that doesn’t just generate content but actually thinks through problems. Whether it gets us to AGI or not, it’s clear that smarter, reasoning-driven AI is the next frontier. For now, we’ll just have to wait and see if o3 lives up to the hype or if this last gift from OpenAI is just a disguised lump of coal.

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Latest Tech News

Asus' latest monitor releases come with a kit to mount a mini PC at the back
There's also a groove to place your smartphone, plus an integrated USB hub
Sadly it is not a 4K display, merely a full HD+ one

As Mini PCs are becoming increasingly powerful, offering a compact design and a wealth of ports, they offer a versatile solution for users who need a powerful setup but don’t necessarily have the workspace to dedicate to a traditional desktop PC.

Recognizing this trend, Asus has introduced two 24-inch monitors, the BE248CFN and BE248QF, which are designed to accommodate these miniature marvels. Each monitor includes a mounting kit to securely attach a mini PC at the back of the stand, positioned closer to the base for easier access.

The two monitors offer other practical features, including a groove at the base that you can use to stash a smartphone. There’s also an integrated USB hub for users managing multiple devices.

Not 4K, sadly

Asus BE248CFN screen with mini PC — (Image credit: Asus)

Both models offer ergonomic adjustments to suit various viewing preferences. The stands support tilt from -5 to 35 degrees, swivel 180 degrees left and right, pivot 90 degrees in either direction, and 130mm of height adjustment. The IPS panels deliver wide 178-degree viewing angles and 16.7 million colors, with a 5ms response time, 350cd/m² brightness, and a contrast ratio of 3,000:1.

Rather disappointingly, the display resolution of the two screens is Full HD+ (1,920 x 1,200), rather than 4K upwards, which may limit their appeal to those requiring higher detail or sharper visuals, such as content creators, or those who like to have a lot of windows open on screen at the same time.

Connectivity varies slightly between the two models. The BE248CFN includes HDMI 1.4, DisplayPort 1.4, USB Type-C with a 96W power delivery function, a four-port USB 3.2 Gen 1 hub, and Gigabit Ethernet. The BE248QF adds a mini D-Sub 15-pin connector, catering to users with legacy hardware.

Both monitors incorporate 2W stereo speakers and Asus Eye Care technologies, such as Flicker-Free and Low Blue Light, which should make them comfortable to use during extended work sessions.

There’s no word on pricing or global availability as yet, but they should be on sale soon, starting in Japan, before hopefully heading to other countries.

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Thursday, December 19, 2024

I Set Up My Own ADT Home Security System. Here's How It Works

Commentary: I didn't need a technician to come to my home to set up ADT's smart security system. Here's what it includes and how I did my own DIY installation.

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Latest Tech News

Apple developing "Baltra" server chip for AI, targeting 2026 production
Israeli silicon team leading project; Mac chip canceled for focus
Broadcom collaboration and TSMC’s N3P tech to enhance development

Apple is reportedly developing its first server chip tailored specifically for artificial intelligence.

A paywalled report by Wayne Ma and Qianer Liu in The Information claims the project, codenamed “Baltra,” aims to address the growing computational demands of AI-driven features and is expected to enter mass production by 2026.

Apple’s silicon design team in Israel, which was responsible for designing the processors that replaced Intel chips in Macs in 2020, is now leading the development of the AI processor, according to sources. To support this effort, Apple has reportedly canceled the development of a high-performance Mac chip made up of four smaller chips stitched together.

Central to Apple’s efforts

The report notes this decision, made over the summer, is intended to free up engineers in Israel to focus on Baltra, signaling Apple’s shift in priorities toward AI hardware.

Apple is working with semiconductor giant Broadcom on this project, using the company’s advanced networking technologies needed for AI processing. While Apple usually designs its chips in-house, Broadcom’s role is expected to focus on networking solutions, marking a new direction in their partnership.

To make the AI chip, The Information says Apple plans to use TSMC’s advanced N3P process, an upgrade from the technology behind its latest processors, like the M4. This move highlights Apple’s focus on enhancing performance and efficiency in its chip designs.

The Baltra chip is expected to drive Apple’s efforts to integrate AI more deeply into its ecosystem. By leveraging Broadcom’s networking expertise and TSMC's advanced manufacturing techniques, Apple appears determined to catch up to rivals in the AI space and establish a stronger presence in the industry.

In November 2024, we reported that Apple approached its long-time manufacturing partner Foxconn to build AI servers in Taiwan. These servers, using Apple’s M-series chips, are intended to support Apple Intelligence features in iPhones, iPads, and MacBooks.

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Wednesday, December 18, 2024

Sony’s WF-1000XM5 Wireless Earbuds Make a Great Gift at This Record-Low Price

The Sony WF-1000XM5 wireless earbuds offer superb sound quality and you can now snag them at Amazon for $198, their lowest price ever.

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Latest Tech News

Huawei may be adding HBM support to Kunpeng SoC
Clues hint at a replacement for the Kunpeng 920, launched in 2019
New SoC with HBM may target HPC, server market rivals

Huawei engineers have reportedly released new Linux patches to enable driver support for High Bandwidth Memory (HBM) management on the company’s ARM-based Kunpeng high-performance SoC.

The Kunpeng 920, which debuted in January 2019 as the company’s first server CPU, is a 7nm processor featuring up to 64 cores based on the Armv8.2 architecture. It supports eight DDR4 memory channels and has a thermal design power (TDP) of up to 180W. While these specifications were competitive when first introduced, things have moved on significantly since.

Introducing a new Kunpeng SoC with integrated HBM would align with industry trends as companies seek to boost memory bandwidth and performance in response to increasingly demanding workloads. It could also signal Huawei’s efforts to maintain competitiveness in the HPC and server markets dominated by Intel Xeon and AMD EPYC.

No official announcement... yet

Phoronix’s Michael Larabel notes that Huawei has not yet formally announced a new Kunpeng SoC (with or without HBM), and references to it are sparse. Kernel patches, however, have previously indicated work on integrating HBM into the platform.

The latest patches specifically address power control for HBM devices on the Kunpeng SoC, introducing the ability to power on or off HBM caches depending on workload requirements.

The patch series includes detailed descriptions of this functionality. Huawei explains that HBM offers higher bandwidth but consumes more power. The proposed drivers will allow users to manage HBM power consumption, optimizing energy use for workloads that do not require high memory bandwidth.

The patches also introduce a driver for HBM cache, enabling user-space control over this feature. By using HBM as a cache, operating systems can leverage its bandwidth benefits without needing direct awareness of the cache’s presence. When workloads are less demanding, the cache can be powered down to save energy.

While we don't have any concrete details on future Kunpeng SoCs, integrating HBM could potentially allow them compete more effectively against other ARM-based server processors, as well as Intel’s latest Xeon and AMD EPYC offerings.

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Tuesday, December 17, 2024

Latest Tech News

Slim-Llama reduces power needs using binary/ternary quantization
Achieves 4.59x efficiency boost, consuming 4.69–82.07mW at scale
Supports 3B-parameter models with 489ms latency, enabling efficiency

Traditional large language models (LLMs) often suffer from excessive power demands due to frequent external memory access - however researchers at the Korea Advanced Institute of Science and Technology (KAIST), have now developed Slim-Llama, an ASIC designed to address this issue through clever quantization and data management.

Slim-Llama employs binary/ternary quantization which reduces the precision of model weights to just 1 or 2 bits, significantly lowering the computational and memory requirements.

To further improve efficiency, it integrates a Sparsity-aware Look-up Table, improving sparse data handling and reducing unnecessary computations. The design also incorporates an output reuse scheme and index vector reordering, minimizing redundant operations and improving data flow efficiency.

Reduced dependency on external memory

According to the team, the technology demonstrates a 4.59x improvement in benchmark energy efficiency compared to previous state-of-the-art solutions.

Slim-Llama achieves system power consumption as low as 4.69mW at 25MHz and scales to 82.07mW at 200MHz, maintaining impressive energy efficiency even at higher frequencies. It is capable of delivering peak performance of up to 4.92 TOPS at 1.31 TOPS/W, further showcasing its efficiency.

The chip features a total die area of 20.25mm², utilizing Samsung’s 28nm CMOS technology. With 500KB of on-chip SRAM, Slim-Llama reduces dependency on external memory, significantly cutting energy costs associated with data movement. The system supports external bandwidth of 1.6GB/s at 200MHz, promising smooth data handling.

Slim-Llama supports models like Llama 1bit and Llama 1.5bit, with up to 3 billion parameters, and KAIST says it delivers benchmark performance that meets the demands of modern AI applications. With a latency of 489ms for the Llama 1bit model, Slim-Llama demonstrates both efficiency and performance, and making it the first ASIC to run billion-parameter models with such low power consumption.

Although it's early days, this breakthrough in energy-efficient computing could potentially pave the way for more sustainable and accessible AI hardware solutions, catering to the growing demand for efficient LLM deployment. The KAIST team is set to reveal more about Slim-Llama at the 2025 IEEE International Solid-State Circuits Conference in San Francisco on Wednesday, February 19.

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Monday, December 16, 2024

Meta's Ray-Bans Can Now Do Real-Time Live AI And Translation

Continuous AI assistance through always-on cameras, plus translation, are coming to Meta's ever-evolving AI-equipped glasses.

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Latest Tech News

Polysoft offers SSD upgrades for Mac Studio at significantly lower prices
StudioDrive features overvoltage protection and durable components
Offered in 2TB, 4TB, and 8TB capacities, shipping next year

Apple introduced the Mac Studio in 2022 with the M1 chip, followed by the M2 model in 2023, and although these compact powerhouses have been lauded for their performance, buyers have rightly expressed concerns about the limited base SSD configurations and the absence of post-purchase upgrade options.

External USB-C or Thunderbolt SSDs are a common workaround for users seeking additional storage, but they don't match the speed and convenience of internal storage solutions.

Stepping in to address this gap, French company Polysoft has created the first publicly available SSD upgrade solution for Apple Silicon devices. Offered at a fraction of Apple’s prices, these SSD modules are the result of an extensive reverse-engineering process.

Better than Apple

Unlike SSDs used in PCs, Apple’s storage modules are challenging to replicate due to their integration with the M1 and M2 chips, where the storage controller resides.

Polysoft’s efforts included detailed disassembly, component analysis, and redesign, culminating in the StudioDrive SSD which is set to launch next year following a successful Kickstarter campaign.

Polysoft claims its SSDs not only replicate Apple’s modules but also improve on them.

A key difference is the inclusion of "RIROP" (Rossmann Is Right Overvoltage Protection), a safeguard inspired by Louis Rossmann’s work on hardware reliability. This feature reportedly protects against voltage surges, reducing the risk of catastrophic data loss due to hardware failure.

The StudioDrive product line supports both M1 and M2 Mac Studio models. It includes blank boards for enthusiasts and pre-configured options in 2TB, 4TB, and 8TB capacities. Polysoft says that the modules use high-quality Kioxia and Hynix TLC NANDs, offering performance and durability comparable to Apple’s original storage solutions. The drives are backed by a five-year warranty and have a lifespan of up to 14,000 TBW.

Pricing starts at €399 ($419) for 2TB, €799 ($839) for 4TB, and €1,099 ($1,155) for 8TB. While these upgrades will no doubt be viewed as an affordable, and welcome solution by many Mac Studio owners, users should be aware that installing third-party storage will void Apple’s warranty.

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Sunday, December 15, 2024

Getting New Glasses? This Is How to Pick the Best Glasses for Your Face Shape and Skin Color

Finding the perfect pair of glasses is a little easier when you follow these tips.

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Latest Tech News

Minisforum's customizable MS-A1 has AM5 socket for Ryzen CPUs
Compact design with up to 16TB storage, includes OCuLink port
Wi-Fi 6E, USB4, and advanced cooling for high performance

The Minisforum MS-A1 is the latest addition to the company's line of powerful mini PCs, and is the spiritual successor to the MS-01 model.

Unlike its predecessor, the MS-A1 introduces the option of swapping CPUs, utilizing an AM5 socket to take various AMD Ryzen processors, including AMD's 7000 series, 8000 PHX architecture (8700G/8600G), and potentially the AMD 9000 series following a BIOS update. It supports up to AMD 8700G APU for graphics.

The Minisforum MS-A1 is available as a barebone system (without a CPU or OS) starting at $259 or as a pre-configured model. At the moment, there’s an offer to save $20, bringing the barebone price down to $239. You can add the Minisforum Deg1 OCuLink graphics docking station when purchasing the workstation for an additional $99, which allows the system to drive up to four 8K screens simultaneously.

Staying cool

The mini PC supports up to 16TB of storage via four SSDs using PCIe 4.0 M.2 slots. There are five USB Type-A ports, a USB4 port capable of 40Gbps, the OCuLink interface, and dual Ethernet RJ45 ports supporting up to 2.5Gbps each.

For display outputs, the device includes HDMI 2.1 and DisplayPort 2.0 connections, with the USB4 interface also supporting screen output. Without an eGPU, it can still drive three 8K displays. For wireless connectivity, the Minisforum MS-A1 offers WiFi 6E and Bluetooth 5.2.

The mini PC's housing is compact and constructed from a mix of metal and plastic. The Cold Wave cooling system, featuring dual fans and quad heat pipes, prevents overheating even when under load.

With customizable CPU options and affordable eGPU support, the Minisforum MS-A1 offers a flexible, mini PC solution that is ideal for users seeking a compact yet powerful workstation for content creation, multitasking, gaming, or general productivity.

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Saturday, December 14, 2024

Traeger Is Cooking Up Delicious Savings of Up to $300 in Time for the Holidays

Give the budding chef in your life the gift of a sturdy Traeger grill at substantial savings this holiday season.

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